Thermal Conductive Interface Material -AMG

  • GTSR Series thermally conductive interface materials are with electrical isolation property. It is especially suitable for applications where low mounting pressures for component clamping is required e.g. low component clamping forces for discrete semiconductors mounted with spring clips for a speedy assembling process .The smooth and compliant surface characteristics of GTSR materials can minimize interfacial thermal resistance and maximize thermal performance for such applications.